i ntegrated c ircuits d ivision www.ixysic.com ds-CPC1916-r06 1 CPC1916 single-pole, normally open optomos ? power sip relay e 3 pb part # description CPC1916y 4-pin (8-pin body) power sip package (25 per tube) parameter rating units blocking voltage 100 v p load current 2.5 a rms / a dc on-resistance (max) 0.34 ? applications features description ordering information pin configuration ? industrial controls ? motor control ? robotics ? medical equipment?patient/equipment isolation ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? ic equipment ? home appliances ? handle load currents up to 2.5a dc /a rms ? 2500v rms input/output isolation ? power sip package ? high reliability ? no moving parts ? low drive power requirements (ttl/cmos compatible) ? arc-free with no snubbing circuits ? no emi/rfi generation ? machine insertable, wave solderable ixys integrated circuits division and ixys have combined to bring optomos ? technology, reliability, and compact size to a new family of high-power, solid state relays. as part of that family, the CPC1916 is a single-pole, normally open (1-form-a) solid state relay. the CPC1916 employs optically coupled mosfet technology to provide 2500v rms of input to output isolation. the optically coupled outputs, that use patented optomos architecture, are controlled by a highly efficient gaaias infrared led. the combination of low on-resistance and high load- current handling capabilities makes the relay suitable for a variety of high-performance switching applications. switching characteristics of normally open devices approvals ? ul 508 certified component: file e69938 form-a i f i load 10% 90% t on t off 1 - 2 + 34
i ntegrated c ircuits d ivision www.ixysic.com 2 r06 CPC1916 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. absolute maximum ratings @ 25oc parameter ratings units blocking voltage 100 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw isolation voltage, input to output 2500 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 3.33 mw / oc parameter conditions symbol min typ max units output characteristics load current, continuous free air i l - - 2.5 a rms / a dc peak load current t < 10ms i lpk --6 a p on-resistance 1 i l =1a r on - - 0.34 ? off-state leakage current v l =100v p i leak --1a switching speeds turn-on i f =10ma, v l =10v t on --5 ms turn-off t off --3 input characteristics input control current to activate i l =1a i f - 3.3 10 ma input control current to deactivate - i f 0.3 - - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r - - 10 a common characteristics capacitance, input/output - - - 2 - pf 1 measurement taken within 1 second of on-time. electrical characteristics @ 25oc parameter conditions symbol min typ max units thermal resistance (junction to case) - r ? jc - 1.5 - c/w thermal characteristics
i ntegrated c ircuits d ivision CPC1916 www.ixysic.com 3 r06 performance data* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. 45 40 35 30 25 20 15 10 5 0 1.250 1.254 1.258 1.262 1.266 led forward voltage (v) device count (n) typical led forward voltage drop (n=50, i f =10ma, t a =25oc) 3.5 4.5 5.5 3.0 4.0 5.0 turn-on (ms) device count (n) 25 20 15 10 5 0 typical turn-on time (n=50, i f =10ma, i l =5ma dc , t a =25oc) 0.073 0.079 0.085 0.070 0.076 0.082 turn-off (ms) device count (n) 25 20 15 10 5 0 0.088 typical turn-off time (n=50, i f =10ma, i l =5ma dc , t a =25oc) 35 30 25 20 15 10 5 0 0.212 0.216 0.220 0.228 0.224 0.232 device count (n) on-resistance ( : ) typical on-resistance distribution (n=50, i f =10ma, i l =1.0a dc , t a =25oc) 35 30 25 20 15 10 5 0 119.1 119.6 120.0 120.6 121.1 121.6 blocking voltage (v p ) device count (n) 122.1 typical blocking voltage distribution (n=50, t a =25oc) typical led forward voltage drop vs. temperature led forward voltage drop (v) temperature (oc) 1.8 1.6 1.4 1.2 1.0 0.8 -40 -20 0 20 40 60 80 120 100 i f =50ma i f =20ma i f =10ma typical turn-on vs. led forward current (i l =100ma dc ) led forward current (ma) turn-on (ms) 0 5 1015202530354045 6.0 5.4 4.8 4.2 3.6 3.0 2.4 1.8 1.2 0.6 0 50 typical turn-off vs. led forward current (i l =100ma dc ) led forward current (ma) turn-off (ms) 0 5 1015202530354045 0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 50 typical i f for switch operation vs. temperature (i l =100ma dc ) led current (ma) -40 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 temperature (oc) typical turn-on vs. temperature (i l =100ma dc ) turn-on (ms) -40 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 i f =10ma i f =20ma temperature (oc) typical turn-off vs. temperature (i l =100ma dc ) turn-off (ms) -40 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 -20 0 20 40 60 80 100 i f =10ma i f =20ma temperature (oc)
i ntegrated c ircuits d ivision www.ixysic.com 4 r06 CPC1916 performance data* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. typical on-resistance vs. temperature (i f =10ma, i l =1.0a dc ) -40 0.36 0.32 0.28 0.24 0.20 0.16 0.12 0.08 0.04 0 -20 0 20 40 60 80 100 on-resistance ( : ) temperature (oc) load voltage (v) load current (a) -0.6 -0.4 -0.2 0.2 0.4 0 0.6 2.5 2.0 1.5 1.0 0.5 0 -0.5 -1.0 -1.5 -2.0 -2.5 typical load current vs. load voltage (i f =10ma, t a =25oc) typical blocking voltage vs. temperature blocking voltage (v p ) -40 131 129 127 125 123 121 119 117 115 -20 0 20 40 60 80 100 temperature (oc) typical leakage vs. temperature at measured across pins 3 & 4 (v l =100v) -40 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0 -20 0 20 40 60 80 100 temperature (oc) leakage ( p a) time 10 p s 100 p s 1ms 10ms 100ms 1s 10s 100s load currrent (a) 2 3 4 5 6 7 energy rating curve (free air, no heat sink) maximum load current vs. temperature load current (a dc /a rms ) temperature (oc) -40 -20 0 20 40 60 80 120 100 i f =20ma i f =10ma 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0
i ntegrated c ircuits d ivision CPC1916 www.ixysic.com 5 r06 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating CPC1916y msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time CPC1916y 245oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-CPC1916-r06 ?copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/17/2012 for additional information please visit our website at: www.ixysic.com CPC1916 6 mechanical dimensions dimensions mm (inches) 1.150 dia. x4 (0.045 dia. x4) 2.540 (0.100) pin 1 10.160 (0.400) 5.080 (0.200) 1.75 (0.069) 10.1600.127 (0.4000.005) 21.0820.381 (0.8300.015) 4.5720.127 (0.1800.005) 1.0160.127 (0.0400.005) 10.1600.127 (0.4000.005) 1.778 (0.070) 5.0800.127 (0.2000.005) 2.5400.127 (0.1000.005) 0.7620.076 (0.0300.003) 1.6510.102 (0.0650.004) 7o typ 4 places 7o typ 4 places 3.3020.051 (0.1300.002) 0.3810.013 (0.0150.0005) 1.778 (0.070) pcb hole pattern pin 1 CPC1916y
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